Intern, Signal & Power Integrity (Summer 2026)
About The Position
We are offering an exciting opportunity at SK Hynix America for an IC Packaging electromagnetic (EM) simulations and SIPI (Signal Integrity/Power Integrity) Analysis Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in 3D modeling and high-speed digital system analysis of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success. Projects will be assigned to the intern(s): High-Speed Signal Integrity Analysis for 2.5D IC Packages.
Requirements
- Currently pursuing a Master's or PhD's degree in Electrical Engineering or a related field.
- Strong interest in transmission line theory, electromagnetic concepts and its applications in semiconductor packaging.
- Strong interest in signal integrity, power integrity fundamentals and its applications in semiconductor packaging.
- Strong problem-solving and analytical skills.
- Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.
Nice To Haves
- Currently pursuing a PhD's degree in Electrical Engineering or a related field
- Familiarity with SIPI simulation tools such as Ansys AEDT (HFSS, Q3D), Synopsys Sigrity, ADS, and HSPICE.
- Basic understanding of semiconductor packaging concepts and materials is advantageous.
Responsibilities
- Become familiar with various IC packaging structures and the process steps involved in making the end product.
- Learn the basics of using numerical analysis tools such as ANSYS AEDT(HFSS, Q3D) etc.
- Learn the basics of using numerical analysis tools such as ADS, HSPICE etc.
- Start developing package-level electrical Finite Element Analysis (FEA) Models to characterize S-parameters and RLC in the packages.
- Conduct signal and power integrity simulations across the entire product lifecycle, from feasibility and pre-layout to post-layout and validation.
- Learn to design and layout guidelines for IC packages and PCBs to ensure signal and power integrity.
- Document all simulation models, codes, and scripts and present the results in simple and clear terms to a broader audience.
Benefits
- Eligible interns will receive a housing allowance during their internship.
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What This Job Offers
Career Level
Intern
