Intern, Product Engineer

Amkor Technology • Tempe, AZ

27d • Onsite

About The Position

Amkor Technology, Inc. (Nasdaq: AMKR) is the world's largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world's leading semiconductor and electronics companies to bring advanced technologies to market. The company's comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.
Position Summary:
Amkor Technology is seeking a qualified student to intern for the Advanced Flip Chip BGA and Chiplets product team based at the corporate offices in Tempe, AZ. The Intern will work closely with various product engineers, supporting projects throughout the year. We are looking for a candidate with a strong analytical capability and well-developed problem-solving skills, with the ability to effectively communicate findings and recommendations. Interest or experience with Agentic AI, Microsoft Copilot, or Power Automate will be a plus.

Requirements

• Student applicants must be currently enrolled in a four-year accredited college or university pursuing a Bachelor's Degree in Engineering
• Candidate must have completed at least their Junior year prior to the start of the internship
• Candidate must have a minimum 3.0 GPA (based on a 4.0 scale)
• Strong verbal and written communication skills
• High aptitude to learn new concepts while performing tasks with attention to detail
• Motivated, self-starter and ability to manage multiple tasks
• Must be available to begin the internship in May 2026 and for a minimum of one (1) year; Amkor internships offer flexible part-time schedules during the semester requiring full-time availability during the summer

Nice To Haves

• Experience with any standard AI LLM tool (OpenAI Chat-GPT, Microsoft Copilot, Facebook Llama, Google Gemini etc...)
• Understanding of basic prompt engineering / prompting methodologies
• Proficiency with Microsoft Office tools (PowerPoint, Excel, Project, Word, etc.)
• Interest in the Semiconductor packaging industry is a plus

Responsibilities

• Learn about and support Customer, Product and Marketing strategies within semiconductor packaging
• Collect, analyze and understand product analytics to integrate into a strategy to win in target markets
• Assist in developing Industry 4.0 using Copilot AI tools to monitor and review product profitability.
• Work on projects that will support pricing analysis, volume allocation and effective utilization of factory equipment
• At the end of the internship, Intern will deliver a summary of their experience, including recommendation of future steps

What This Job Offers

• Job Type: Part-time
• Career Level: Intern
• Number of Employees: 5,001-10,000 employees