Draper is seeking someone to lead our Science and Technology (S&T) efforts related to Hardened Microelectronics Engineer (HME) within our engineering organization. Reporting to the Principal Director for Science and Technology (S&T), this position will have the primary responsibility of aligning Draper’s microelectronics engineering technology development efforts with corporate technology strategy as well as the strategies of individual business offices. The Hardened Microelectronics Engineer (HME), will lead work in shaping technical strategies, integrated development plans with business offices. You will support the shaping, pursuit, and capture of external programs within the DoD S&T community (DARPA, ONR, AFRL, NRL) as well as commercial partners and help provide oversight on the execution of these S&T projects. The Hardened Microelectronics technical scope will include advanced ASIC design, 3D/HI packaging technology, embedded cyber physical security, anti-tamper, radiation hardening and design for other extreme environments, and collaboration with our fabrication teams and facilities.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
1,001-5,000 employees