Failure Analysis Engineer
About The Position
Broadcom is seeking an experienced and driven Failure Analysis Engineer. In this role, you will be the technical lead who ensures the successful diagnosis and characterization of complex failures in advanced silicon (e.g., FinFET, GAA) and advanced packaging technologies (e.g., CoWoS-S/L, 3DIC, CPO) critical to Broadcom's most sophisticated products, including our industry-leading AI accelerators and high-speed networking solutions. You will leverage your deep expertise across all facets of FA (i.e., fault isolation, EFA, PFA) to pioneer new workflows tailored for the rapidly evolving landscape of next-generation silicon and packaging technologies. This role is built for a hands-on, strategic problem-solver seeking an opportunity to grow as a technical leader, collaborate with global cross-functional teams, and ensure the highest quality in bleeding edge technologies.
Requirements
- Bachelor's and 8+ years of relevant experience, or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field and 6+ years of relevant experience.
- Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies.
- Proficiency in various failure analysis techniques and equipment (e.g., scan diagnostics, PEM, DLS, nanoprobing, SEM, EDS, FIB).
- Excellent problem-solving skills and a methodical approach to root cause analysis.
- Ability to work independently and as part of a team in a fast-paced environment.
- Broad interests, self-driven, lifelong learner, and a good team member.
- Expert project management skills, capable of managing multiple root cause projects in conjunction with lab support.
Nice To Haves
- Experience with <5nm finFET or GAAFET technologies
- Experience with 3DICs, CoWoS-L, co-packaged optics (CPO), or co-packaged copper (CPC)
- Expertise in design-based FA (scan and memory diagnostics)
- Expertise in beam-based FA techniques (e.g., nanoprobing, PFIB delayering / cross-section)
- ATE test flow generation, pattern modification, and hardware
- In-depth knowledge of advanced package construction and failure analysis
Responsibilities
- Hands on technical expert capable of in depth fault analysis across a wide range of silicon and package technology.
- Plan and execute individual FA plans through background data collection, ATE datalog interpretation, non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace)
- Fault localization (ATE, application board, PEM, DLS, OBIRCh, thermal, scan, memory)
- Physical Analysis (mechanical, chemical, PFIB), nanoprobing, and analytical techniques (FIB, SEM, EDX) to isolate and characterize defects.
- Collaborate with global cross-functional teams (design, process, test, reliability) to identify root causes of failures from various stages of the product lifecycle (e.g., design, reliability, RMA).
- Clear communication of complex FA findings, both written and verbal, to enable data-driven corrective action of critical quality issues.
- Develop and implement new failure analysis methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.
- Evaluate & stay updated on the latest advancements in failure analysis techniques and semiconductor technology.
- Team-based culture through open communication, continuous improvement, and willingness to assist others.
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company paid holidays
- paid sick leave and vacation time
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Number of Employees
5,001-10,000 employees
