Member of the engineering team responsible for investigating and resolving product issues for Industry Standard Servers. Works closely with customers and internal teams—including Foxconn R&D, Product Engineering, and Quality Engineering—to analyze factory and field failure symptoms. Performs detailed hardware and circuit failure analysis to identify root causes at the component level. Supports the implementation of corrective actions and provides feedback to improve product quality. Collaborates with cross-functional engineering disciplines and participates in special capture programs to drive continuous improvement within the ESSN Server Products portfolio. II. ESSENTIAL FUNCTIONS Perform engineering investigations of significant customer returns, field failures, and line escalations related to hardware issues. Improve customer satisfaction and product quality through timely resolution of hardware-related failures. Interface directly with design and manufacturing teams to determine root cause of hardware failures down to the component level. Collaborate with various internal engineering disciplines (hardware, software, mechanical, materials, reliability) to resolve hardware issues. Facilitate execution of special capture programs such as ARDAP, Early Field Capture, and Selective Field Capture. Provide feedback to internal and external design and process teams based on failure analysis findings. Support internal communication of failure analysis techniques and processes to be deployed across global RMA and service centers, improving product knowledge and enhancing PCA debug efficiency. Drive best practices implementation across worldwide operational, RMA, and service sites. Perform additional duties as assigned.