Failure Analysis Engineer (GL6 Test)

Foxconn Industrial Internet•Mount Pleasant, WI

30d

About The Position

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Failure Analysis Engineer to support failure analysis investigations on PCB/PCBA issues and support Hardware design and Operations engineering activities. Once a part of the team, you will be responsible for a wide variety of tasks within the Operations Department and in an R&D Lab and production-support environment and have the opportunity to display strong technical and leadership skills to expand your career in Smart Manufacturing. The Failure Analysis Engineer will support comprehensive testing and reporting activities, be part of a team of engineers and technicians, and drive the development of new methods and analytical capabilities while assisting the Operations Department as needed.

Requirements

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related technical field required.
3-5 years of experience in electronics failure analysis, debugging, or product design for computing and storage platforms.
Demonstrated ability to debug complex hardware issues using logic analyzers, oscilloscopes, multimeters, and related test equipment.
Strong understanding of server and storage technologies, including Intel and AMD x86/ARM multicore processors, DDR2–DDR5 and NAND memory, and PCA design.
Working knowledge of high-speed interfaces and protocols such as PCIe, SAS, SATA, NVMe, SCSI, Ethernet, Fibre Channel, Wi-Fi, and Bluetooth.
Familiarity with full hardware/software development life cycle, including firmware and diagnostic test methodologies.
Ability to deduce failure mechanisms from failure symptoms.
Proven experience collaborating with cross-functional and cross-organizational teams.
Excellent analytical and problem-solving skills with strong attention to detail.
Strong written and verbal communication skills with the ability to present findings to both technical and non-technical audiences.
Self-motivated and able to perform effectively in a fast-paced, customer-oriented environment with minimal supervision.
Must be able to sit or stand for extended periods; must be able to lift up to 50 lbs.

Responsibilities

Support failure analysis investigations on PCBAs and Systems thru interpretation of failure symptoms and identification of failure modes driving RCCA to be taken to prevent reoccurrence.
Operate, educate, and expand the use of failure analysis and engineering testing equipment, ensuring timely and accurate reporting.
Facilitate the execution of special failure capture programs to address elevated failure event rates (3LS of L6, L10, Selective & Early Field Capture, ORT and RMA)
Develop and communicate Technical Troubleshooting Guidelines and analytical techniques that can be deployed across global manufacturing, RMA & Service centers.
Drive standardization and implementation of ‘best circuit analysis practices’ across worldwide FA, Test, Repair, RMA & Service operations.
Summarize, analyze, and record test results, preparing formal reports for customers and internal global teams.
Perform and oversee teardown of mechanical and electronic assemblies for lab analysis while preserving areas of interest.
Provide leadership, training, and oversight to FA, Test engineers and technicians across multiple shifts.
Foster a Safety First culture and ensure compliance with internal and external policies.
Other duties as assigned.

Benefits

Comprehensive benefits package including medical, dental, and vision insurance coverage.
Basic life insurance and short-term disability coverage provided by employer.
Supplemental life insurance and long-term disability coverage options available.
401K with employer contribution.
Personal, Vacation, and Holiday paid time off for all full-time employees.
Onsite Aurora Health & Wellness Center available for all employees.
Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

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