This position’s primary function is to ensure the overall equipment effectiveness of semiconductor and packaging process equipment in our fabs. We are filling positions for equipment engineers in these functional equipment areas: lithography, high-vacuum plasma, wet processing, mechanical processing, and metrology and inspection. Equipment engineers will be responsible for equipment installation, the creation of equipment maintenance procedures and schedules, parts-and-kit selection-or-creation. Equipment engineers will work closely with process tool owners and integration engineers to ensure we are driving fast cycles of learning in semiconductor advanced packaging. Each equipment engineer will be responsible for one of these functional groups of equipment. TIE is filling one position per functional area. Lithography: Coat tracks, Steppers, Litho-specific metrology High-Vacuum Plasma: CVD, Etch, Plasma Dicing, PVD Wet Processing: Batch cleaning, single wafer cleaning, plating. Mechanical Processes: CMP, Grinding, Dicing, Bonding. Metrology and Inspection: SEM, Defect Inspection, Film Thickness, Microscopes
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
251-500 employees