Engineering Specialist III

Seagate TechnologyBloomington, MN
1d$24 - $34Onsite

About The Position

Work with a team of engineers in integration/photo/ICP/materials/plating/CMP/wetetch process to deliver advanced writers with designed magnetic, electrical, and thermo-mechanical performance for the next generation products. Participate in hands-on investigation and resolution of process issues with frequent factory-floor presence. Provide hands on work in a clean room environment and failure analysis for engineers providing FIB cuts, SEM inspections and other engineering requests. Assist with performing MDA’s and dispositioning of wafers with guidance from engineers. Consistently work on complex assignments requiring independent action and a high degree of initiative to resolve issues. Make recommendations for new procedures. As a skilled specialist, you will complete complex tasks in creative and effective ways. Shift will be Monday – Friday starting at 7:30 am; 8 hour days.

Requirements

  • You are self-motivated, able to work independently, and have strong attention to detail.
  • You are a team player capable of working in strong partnership with and communicating effectively with a diverse group of engineers and technicians.
  • You are able to maintain thorough documentation of results and be able to clearly discuss them with the engineering staff.
  • You are able and willing to adapt to changing needs of a fast-paced development program.
  • Experience working assignments requiring initiative and make recommendations for solutions.
  • Knowledge of basic analysis and presentation software (Excel, Powerpoint,…)

Nice To Haves

  • Associate's Degree with minimum of 2 ‐ 4 years of related clean room experience.
  • Knowledge of thin film recording head processing is preferred but not required.
  • Hands-on experience in thin film processing is preferred.
  • Knowledge of factory information systems preferred but not required (MES, Xsite, SPC).

Responsibilities

  • Work with a team of engineers in integration/photo/ICP/materials/plating/CMP/wetetch process to deliver advanced writers with designed magnetic, electrical, and thermo-mechanical performance for the next generation products.
  • Participate in hands-on investigation and resolution of process issues with frequent factory-floor presence.
  • Provide hands on work in a clean room environment and failure analysis for engineers providing FIB cuts, SEM inspections and other engineering requests.
  • Assist with performing MDA’s and dispositioning of wafers with guidance from engineers.
  • Consistently work on complex assignments requiring independent action and a high degree of initiative to resolve issues.
  • Make recommendations for new procedures.
  • Complete complex tasks in creative and effective ways.

Benefits

  • medical
  • dental
  • vision
  • life insurance
  • short- and long-term disability
  • eligibility to participate in discretionary bonus program
  • 401(k)
  • employee stock purchase plan
  • flexible and dependent care spending accounts
  • health care spending accounts
  • paid time off, including 12 holidays, 120 hours of vacation, a minimum of 48 hours of paid sick leave, and 16 weeks of paid parental leave
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