Engineer, DPA (Destructive Physical Analysis) | EAG Laboratories

Eurofins Scientific•Irvine, CA

28d

About The Position

The DPA Engineer leads and performs advanced analysis of failed semiconductor, LED, solar die-level, or packaged electrical parts. This role requires a strong engineering background, hands-on expertise in destructive and non-destructive techniques, and the ability to innovate and improve processes.

Requirements

Preferred: BS Degree in Electrical, Materials, Chemical Engineering, or related discipline.
5+ years of relevant experience in failure analysis, semiconductor packaging, or electronics reliability.
Expertise in FA techniques and firsthand experience with DPA and related methods.
Strong analytical and problem-solving skills; ability to work independently and multi-task.
Excellent written and verbal communication skills for technical reporting and collaboration.
Familiarity with MIL-STD test methods and industry standards (ISO, JEDEC, AEC, IPC).
Proficiency with lab equipment and software tools (MS Office, LabView, GDS layout).
Knowledge of device physics, IC design, and electronics failure analysis methodology.
Ability to continuously operate a personal computer or lab equipment for extended periods (4+ hours).
Ability to operate a keyboard and other lab equipment, use a telephone, access file cabinets and other items stored at various levels, including overhead.
Must be able to remain in a stationary position 80% of the time.
Ability to communicate clearly and understandably in normal conversational distance, over the telephone, and in group settings.
Ability to handle small and fragile devices with tweezers and/or fingers.
Require close-distance visual acuity with or without correction (glasses, contacts, etc.).
Must be willing and able to wear PPE such as respirator, hard-hat, steel-toed shoes, safety glasses, laboratory coat, and other required devices or equipment.
Ability to learn new tasks, remember processes, maintain focus, complete tasks independently, and make timely decisions in workflow contexts.
Ability to move equipment or items up to 50 lbs.

Responsibilities

Lead Destructive Physical Analysis (DPA) investigations per MIL-STD methods (e.g., MIL-STD-883, MIL-STD-750, MIL-STD-1580) to identify defects and assess reliability risks.
Perform advanced failure analysis using optical/digital microscopy, SEM/EDS, X-ray (2D/real-time), and C-SAM to characterize component construction and detect anomalies.
Conduct cross-sectioning, de-lidding, chemical/plasma etching, hermeticity testing, and other physical analysis techniques.
Design and implement test plans for reliability assessments and root cause investigations in collaboration with multidisciplinary teams.
Develop and standardize new techniques (e.g., microwave-induced plasma etching) and bring new tools online to enhance lab capabilities.
Analyze sub-micron level features to identify failure initiation sites and construction anomalies.
Generate detailed technical reports and present findings to internal teams and customers.
Ensure compliance with industry standards (ISO, JEDEC, AEC, IPC) and customer specifications.
Provide technical guidance to technicians and junior engineers; mentor team members on best practices.
Maintain adherence to safety protocols, Technology Control Plan, and quality system requirements.
Protect confidential information and proprietary processes.