Electroplating Engineer

Skywater•Kissimmee, FL

About The Position

We are looking for a hardworking and passionate Electroplating Process Development Engineer for our Florida Advanced Packaging site working with copper, nickel, SnAg and gold plating. In this role you will develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management. Major Area of Accountability: Own overall responsibility for plating process development area, drive improvements in process, documentation, training with new process development/transfer in a manufacturing environment. Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans. Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications. Utilize metrology tools to characterize and document process results for transfer to production including CVS measurements, bath analysis and additions, thickness and fill characteristics. Investigate and drive integration changes for improved device performance and yield improvement. Work with process integration and tool engineers to find processing marginalities and make improvements. Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by process changes. Directly interface with management as a team leader or area owner for your unit process modules. Could develop into a Project Management position integrating Customer device requests. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Requirements

BS Engineering (8 years), MS/PhD (5 years) preferred in Physics, Electrical Engineering, Materials Science or equivalent.
Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.
5-8 years of engineering experience.
Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans.
MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.
Proficient in DOE and SPC.
Knowledge of 6-sigma concepts and applications.
Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
Can work both independently and in (or lead) cross-functional teams for problem solving.
US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance.

Nice To Haves

Project Management skills and/or defined training a plus.
Experience with customer interfacing to solve problems and transfer processes a plus.

Responsibilities

Own overall responsibility for plating process development area, drive improvements in process, documentation, training with new process development/transfer in a manufacturing environment.
Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans.
Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.
Utilize metrology tools to characterize and document process results for transfer to production including CVS measurements, bath analysis and additions, thickness and fill characteristics.
Investigate and drive integration changes for improved device performance and yield improvement.
Work with process integration and tool engineers to find processing marginalities and make improvements.
Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by process changes.
Directly interface with management as a team leader or area owner for your unit process modules.
Could develop into a Project Management position integrating Customer device requests.
The job also requires performing other duties as assigned.