WORK STYLE DESIGNATION: Onsite WORK STYLE REQUIREMENT: Onsite 100% WORK LOCATION: NCP (Hillsboro, OR) Office EXPECTED PAY RANGE: $58,641 - $108,857 annually This pay range is for the position's base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process. PRIMARY RESPONSIBILITIES EMA I Complete internal training for safe and proficient operation of technical lab equipment. Use a SEM to obtain SE and BSE micrographs. Perform necessary sample preparation techniques to enable subsequent analyses to be conducted on semiconductor wafer samples using various cleaving techniques, ion milling, and thin-film deposition of samples. Build to sustain expected output and quality metrics. Optically differentiate samples and target locations and interpret ‘live’ 3D structures from reference documentation. Exhibit HTA and PEL values throughout workflow – Safety/Integrity, Customer Focus, Challenge, Collaboration, and Growth. Clearly communicate questions, updates, and abstract concepts in person and via email with peers, supervisor/management, and internal customers. Follow all established workflow steps, including activities such as data updates, proper sample prioritization and organization, and shared-space cleaning. EMA IV Develop healthy rapport with PEs and peers to effectively accomplish work goals. Assist senior team members and/or management with small projects. Engage highly in PEL functional teams and grow responsibilities in the lab, including taking on some leadership tasks. Demonstrate expertise in handling incoming jobs and special requests. Show capacity to train fellow team members. Create and maintain SOPs and lab documentation. Responsibilities require the use of creativity, organization, project management, and leadership expertise.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED