ElectroMechanical Packaging Engineer II

Lockheed Martin Corporation•Englewood, CO

42d•Onsite

About The Position

The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. Location: This position does not support teleworking; you will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. What does this role look like? Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations. You will coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. You will establish specifications for contract assemblers and raw-material vendors. You will interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment. Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed. Key activities you will accomplish in this role: Identify initial physical architecture for the Avionics subsystem. Assist with R&D trade studies for Pre-SRR design phase. Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle. Generate and release design disclosure artifacts including technical presentations and end of year reports. Work on a cross-functional team in the development and integration of world class avionics systems. Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis. Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required. Resolve test anomalies and support system level testing.

Requirements

1+ years professional experience.
While no clearance is needed to start in this position, you will need to obtain and maintain a DoD Top Secret clearance, thus US Citizenship is required.
Bachelor of Science or higher from an accredited college in Mechanical or Aerospace Engineering or related discipline, or equivalent experience/combined education.
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
CAD modeling and drafting experience (CREO, SolidWorks and/or similar CAD data modeling experience, model based engineering.
Willing and able to obtain and maintain a DoD Top-Secret clearance, thus US Citizenship is required.

Nice To Haves

Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques).
Working knowledge EPDM tools or equivalent
Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.)
Experience with 3D printing/prototyping
Missile/Aerospace related experience
Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint)
Familiarity with FBM specifications/procedures
Familiarity and experience partnering with SP/SPF Customer Partners
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink)
Previous MRB experience
Ability to communicate issues and additional resource needs to leadership
Experience with subcontracted hardware suppliers
Experience performing tolerance stack-ups
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines
Excellent communication, presentation and interpersonal skills with technical and non-technical audiences including design reviews (SRR, PDR, CDR, etc.)
Hands-on hardware experience

Responsibilities

Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.
Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
Establish specifications for contract assemblers and raw-material vendors.
Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.
Identify initial physical architecture for the Avionics subsystem.
Assist with R&D trade studies for Pre-SRR design phase.
Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end of year reports.
Work on a cross-functional team in the development and integration of world class avionics systems.
Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis.
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required.
Resolve test anomalies and support system level testing.