AY26 Electro-Mechanical Engineering Intern - Orlando

Lockheed Martin•Orlando, FL

1d•Onsite

About The Position

Lockheed Martin Missiles and Fire Control is seeking an Electro-Mechanical Packaging Design Engineer Intern in Orlando, FL. In this role, you will be responsible for the hardware development for military electronics housed within flight-worthy assemblies. Activities will require cross-functional coordination to complete hardware design efforts and support integration efforts for the designated electronic system. The candidate will research, develop, and design components, equipment, and networks for military application. Must be a US Citizen;  this position will require a government security clearance. This position is located at a facility that requires special access.

Requirements

Pursuing an Electrical Engineering, Computer Engineering, or similar major.
Experience with 3-D printing, prototyping, additive manufacturing, etc.
Experience with CREO or similar 3D CAD tools
Must be a US Citizen with the ability to obtain a clearance.

Nice To Haves

High preference for candidates with experience in mechanical design and development.
Ability to apply the principles of Mechanical Engineering to the design and development of complex assemblies.
Experience with semiconductor devices, circuitry within computer devices/cell phones, etc.
Familiarity with Electronic Packaging.
Competency with MS Office products (Excel, Word, PowerPoint).

Responsibilities

hardware development for military electronics housed within flight-worthy assemblies
cross-functional coordination to complete hardware design efforts
support integration efforts for the designated electronic system
research, develop, and design components, equipment, and networks for military application