Director/Senior Engineering Manager (Bilingual Mandarin)– PCBA, System Integration, Process & Manufacturing Engineering

Foxconn Corporation•San Jose, CA

61d

About The Position

The Senior Manager for PCBA, System Integration, Process & Manufacturing Engineering is responsible for leading cross-functional engineering teams in the development, optimization, and sustainment of manufacturing processes for printed circuit board assemblies (PCBAs), system-level integration, and final product assembly. This role ensures manufacturing operations deliver world-class quality, productivity, scalability, and cost competitiveness by driving process innovation, operational excellence, and successful new product introductions (NPIs).

Requirements

Master’s degree in Mechanical, Electrical, Industrial, or Manufacturing Engineering
10+ years of progressive engineering experience in PCBA, system integration, and manufacturing, with at least 5 years in senior leadership role.
Proven track record in high-mix/high-volume production environments.
Deep expertise in SMT, soldering processes, AOI/X-ray, ICT/FCT, and functional testing.
Strong knowledge of mechanical assembly, cabling, and enclosure integration.
Proficient in Lean Manufacturing, Six Sigma, PFMEA, DOE, and SPC.
Exceptional leadership, problem-solving, and cross-functional collaboration skills.

Nice To Haves

Experience with MES, ERP, and Industry 4.0 systems preferred.

Responsibilities

Leadership & Strategic Direction Lead, mentor, and grow high-performing engineering teams across PCBA, system integration, process, and manufacturing engineering functions.
Define and execute the long-term technical roadmap for manufacturing process capability, automation, and quality improvement.
Drive a culture of continuous improvement using Lean, Six Sigma, and Industry 4.0 principles.
Manage engineering budgets, capital equipment investments, and resource planning.
PCBA Process Engineering Oversee SMT, wave solder, selective solder, conformal coating, and inspection processes (AOI, X-ray, ICT/FCT).
Drive DFM/DFT (Design for Manufacturability/Testability) engagement with R&D and suppliers.
Establish and maintain process control metrics (Cp, Cpk, FPY, OEE).
Lead root cause analysis and corrective actions for PCBA-related yield or quality issues.
System Integration & Final Assembly Manage engineering support for electromechanical system integration, sub-assembly builds, and final product assembly.
Develop assembly processes, tooling, fixtures, and test methods for system-level builds.
Optimize line balancing, ergonomics, and material flow to increase throughput and reduce labor content.
Collaborate with test engineering to integrate functional, environmental, and burn-in testing into production flow.
Process & Manufacturing Engineering Standardize manufacturing processes across production lines to ensure scalability and repeatability.
Implement digital manufacturing tools, MES integration, and real-time process monitoring.
Conduct PFMEA, DOE, SPC, and process validation to ensure robust production readiness.
Identify and implement cost-saving opportunities through yield improvement, scrap reduction, and automation.
New Product Introduction (NPI) Lead cross-functional readiness reviews and pilot builds for new products.
Develop process documentation, work instructions, and operator training programs.
Ensure smooth transition from engineering builds to mass production with minimal quality issues.
Compliance & Standards Ensure compliance with IPC standards (IPC-A-610, J-STD-001), ESD controls, and regulatory requirements (RoHS, REACH, ISO 9001).
Maintain equipment calibration, process documentation, and operator certifications.
Performance Metrics First-pass yield (FPY) improvement and defect rate reduction.
On-time and successful NPI launches.
OEE (Overall Equipment Effectiveness) and throughput gains.
Manufacturing cost savings from process and design improvements.