Director, Heterogenous Integration/Advance Packaging

Applied Materials•Santa Clara, CA

5d•$180,000 - $247,500•Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.

Requirements

Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
Proven track record of solving complex problems through innovation and ideation of novel approaches.
Ability to define and develop differentiated modules by leveraging Applied’s broad portfolio of tools.
Thought leader to define and maintain Applied’s roadmap in hybrid and fusion bonding for emerging device architectures
Minimum of MS/PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent
10+ years of experience in advanced packaging specializing in logic, DRAM or NAND
Strong communication skills to be effective in dealing with business units and cross-functional teams
Proven track record of managing customer engagements (technical and business)
Lead projects across organization and culture in a fast-paced environment
Self-starter, team player and able to work independently with minimal supervision