The successful candidate will be in Santa Clara , CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. Key Attributes : D omain expert ise in advanced pa ckaging areas such as W2W / D2W bonding, micro bump s, TSV, thermal management , optic s and multi-wafer stacking with deep understanding of materials , process , device physics and integration . Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology . Proven track record of solving complex problems through innovation and ideation of novel approaches. Ability to d efin e and develop differentiated modules by leveraging Applied’s broad portfolio of tools . Thought leader to d efine and maintain Applied’s roadmap i n hybrid and fusion bonding for emerging device architectures
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
11-50 employees