Defect Metrology Engineer

SkyWater Technology Foundry • Kissimmee, FL

43d

About The Position

We are looking for a Defect Metrology Process Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve AOI and Metrology processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Requirements

• Education: BS Engineering (8 years), MS/PhD preferred (5 years)
• Fab processing tools knowledge/experience and how to support defect feedback to process owners.
• 5-8 years engineering experience.
• Prior Defect inspection experience.
• MEMS/CMOS/Packaging inspection and metrology knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.
• US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

Nice To Haves

• Project Management skills and/or defined training a plus.

Responsibilities

• Develop and maintain Automated Optical Inspection (AOI) processes for advanced packaging processes.
• Daily review of defects and SPC data for excursions, disposition and drive yield improvements in layout and process.
• Ensure metrology supports multiple fab areas with thickness and defect measurements, inspection of pillar heights and location, as well as AFM and profilometry.
• Coordinate with appropriate engineering areas to report die pad locations through automation in fan-out wafer level packaging applications.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts and defects for trends or excursions that can be addressed by integration changes.
• The job also requires performing other duties as assigned.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Industry: Computer and Electronic Product Manufacturing
• Number of Employees: 501-1,000 employees