CPO mechanical/Thermal architect

MediaTek • San Jose, CA

55d

About The Position

1. Collaborate with product architects during the early definition stage to understand and define package architectures and roadmaps. 2. Design optical structures for silicon photonics products, focusing on thermal management, optoelectronic conversion, and packaging process integration. 3. Partner with the design team and external vendors to develop package and thermal solutions, including FAU and supporting mechanical components and thermal, to meet product requirements. 4. Support the prototype fabrication of silicon photonic optical engines, ensuring performance aligns with design and quality standards.

Requirements

• Master's or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
• Experience in developing and deploying silicon photonics solutions to the market.
• Experience in developing and deploying thermal solutions for silicon photonics to the market.
• Over 5 years of experience collaborating with manufacturing partners, including suppliers, OSATs, and foundries.
• In-depth knowledge of various thermal solutions, packaging architectures, such as 3D die stacking, 2.5D CoWoS, and fan-out packaging.

Responsibilities

• Collaborate with product architects during the early definition stage to understand and define package architectures and roadmaps.
• Design optical structures for silicon photonics products, focusing on thermal management, optoelectronic conversion, and packaging process integration.
• Partner with the design team and external vendors to develop package and thermal solutions, including FAU and supporting mechanical components and thermal, to meet product requirements.
• Support the prototype fabrication of silicon photonic optical engines, ensuring performance aligns with design and quality standards.

What This Job Offers

• Job Type: Full-time
• Industry: Computer and Electronic Product Manufacturing
• Number of Employees: 5,001-10,000 employees