CPO Integration Engineer - LPU Packaging

NVIDIA • Santa Clara, CA

1d

About The Position

NVIDIA is looking for a Co-Packaging Optical Engineer to join our LPU Packaging team! NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. We've built an incredible legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing, an era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand and engage with the world! Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their life's work. Come join the team and see how you can make a lasting impact on the world!

Requirements

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field (or equivalent experience)
• 8+ years of experience in semiconductor packaging, with a focus on photonic integration, CPO or advanced packaging
• Hands-on experience with various optical module integration approaches, photonic alignment, and optical coupling techniques
• Understanding of reliability standards and qualification methodologies for optical modules
• Excellent analytical, problem-solving, and communication skills.
• Experience in bringing packaged products from development into production

Nice To Haves

• Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
• Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL)
• Experience working with OSATs and managing external development partners
• Demonstrated ability to lead cross-functional teams and influence technical directions

Responsibilities

• Own the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPi) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability target
• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including optical module integration, and thermal/mechanical compatibility
• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration)
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools
• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
• Present technical updates and roadmaps to internal stakeholders and external partners

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level