Perform a variety of non-destructive and destructive processes in order to determine the integrity and quality of electronic components. These processes range from visual inspection and physical measurement of electronic components, performing real time X-Ray and Acoustic Microscopy of electronic components to performing mechanical and chemical de-encapsulation, internal visual inspection and wire bond pull utilizing various tools such as, XRF, scanning acoustic microscope (SEM), hermeticity test equipment and optical microscopes.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED