Circuit Card Design Engineer Sr

Lockheed Martin • Orlando, FL

1d • Hybrid

About The Position

You will be the Circuit Card Design Engineer – Microelectronics Packaging for Lockheed Martin’s Missiles & Fire Control division. Our team drives the definition, development, and validation of next generation microelectronics processes, tool flows, and design methodologies for multichip packages. By advancing organic, silicon, active silicon, embedded passive, and miniature inductor substrates, you help deliver the size weight power cost (SWAP C) reductions that keep our missile and fire control systems at the cutting edge. What You Will Be Doing As the Circuit Card Design Engineer you will translate high performance circuit card expertise into emerging substrate technologies, create detailed single BGA package designs, and build verification plans that meet stringent Design Assurance standards. You will partner with materials, mechanical, manufacturing, and test groups to ensure packaging solutions flow smoothly from concept to production. Your responsibilities will include:

Requirements

• MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.
• Bachelor of Science in Electrical Engineering (BSEE) or equivalent.
• 7–12 years of hands‑on circuit‑card design experience with a proven record of delivering high‑performance, reliable products.
• Demonstrated ability to work independently while influencing and guiding multidisciplinary teams.
• Strong problem‑solving skills and an innovative mindset toward emerging technologies.
• Excellent written and verbal communication skills for technical documentation and stakeholder presentations.

Nice To Haves

• Master of Science in Electrical Engineering (MSEE) or related field with exposure to microelectronics or advanced packaging.
• Experience with signal and power integrity analysis tools (e.g., SIwave, Ansys Q3D, PowerSI).
• Proficiency in SPICE‑based simulation (Pspice, Spectre, HSPICE).
• Strong command of schematic capture and layout tools such as Siemens Mentor/Xpedition, Cadence Allegro/OrCAD, and Altium Designer.
• Familiarity with emerging substrate technologies and small‑form‑factor inductive components.
• Experience designing multi‑chip modules (MCM) or system‑in‑package (SiP) solutions.
• Knowledge of reliability testing and industry standards for advanced electronic packaging.

Responsibilities

• Define requirements, architecture, and design rules for new multichip package technologies (organic, silicon, active silicon, embedded passives, miniature inductors).
• Develop detailed single BGA package layouts using Siemens Mentor/Xpedition, Cadence Allegro/OrCAD, or Altium Designer and generate complete design data packages.
• Perform signal and power integrity analyses with SIwave, Ansys Q3D, and PowerSI; run circuit simulations in PSpice, Spectre, or HSPICE to verify performance against specifications.
• Create and maintain design flow toolchains, verification environments, and automated test scripts that support rapid prototype iteration.
• Produce technical documentation, standards, and training materials to disseminate best practices across the organization.
• Conduct trade off studies on substrate choices, stack up configurations, and component footprints to meet SWAP C goals.
• Lead cross functional reviews with materials, mechanical, manufacturing, and test teams, ensuring packaging designs are manufacturable and meet reliability targets (thermal, shock, vibration).
• Mentor junior engineers and champion an inclusive, collaborative culture that values diverse perspectives and continuous learning.

Benefits

• Medical, Dental, Vision, Life Insurance, Short-Term Disability, Long-Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid time off, and Holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees