Characterization Fab Engineer Level 1 or 2 (2nd shift)

Northrop Grumman•Linthicum Heights, MD

54d•Onsite

About The Position

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Characterization Fab Engineer Level 1 or 2 position located at our Linthicum, MD facility in the Baltimore area - required to be fully on-site. The Advanced Technology Lab (ATL), part of Northrop Grumman Microelectronics Center (NGMC), located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman's ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading-edge technology development in Superconducting Electronics and SLCFET. Our devices enable a number of Northrop Grumman's ground-based radars, avionic radars, and space systems. The Characterization Fab Engineer will be responsible for but not limited to: Being the first line of defense for the Characterization Engineering fab issues, spending upwards of 60-70% of shift in the cleanroom Maintain existing and creating new in-line metrology and defect metrology recipes and techniques Be hands-on with microscopes for visible inspection Assisting with ongoing efforts to integrate in-line defect metrology into our process flows Supporting operations in addressing lot holds across the fleet of Characterization Engineering tool sets Partner with vendors and equipment engineers to keep tools in good health and ready-to- use state Supporting statistical process control (SPC), continuous improvement efforts, and the management and dissemination of metrology and defect metrology data This position offers an attractive 9/80 work schedule (contingent upon business needs); you'll enjoy working nine-hour days from Monday to Thursday, giving you the rewarding benefit of every other Friday off ! This arrangement facilitates extended weekends for a better work-life balance . This position may be filled as a Characterization Fab Engineer Level 1 or Characterization Fab Engineer Level 2.

Requirements

Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 6 months+ of relevant experience.
General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes).
General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools.
Basic knowledge of statistical process control.
Hands on experience with Si, GaAs, or other wafers.
Ability to work in a cleanroom setting.
Ability to work 2 nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule.
U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required.
Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 2 years of relevant experience
General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes).
General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools.
Basic knowledge of statistical process control.
Hands on experience with Si, GaAs, or other wafers.
Ability to work in a cleanroom setting.
Ability to work 2 nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule.
U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required.

Nice To Haves

Hands on knowledge and operation of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes).
Hands on knowledge and operation of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools.
Experience in lean manufacturing practices and structured problem-solving methodology.
Experience working in a cleanroom setting.
1 year experience with semiconductor fabrication.
Data analysis and visualization (JMP).
Experience developing technical specifications for equipment procurement.
Active Secret clearance.

Responsibilities

Being the first line of defense for the Characterization Engineering fab issues, spending upwards of 60-70% of shift in the cleanroom
Maintain existing and creating new in-line metrology and defect metrology recipes and techniques
Be hands-on with microscopes for visible inspection
Assisting with ongoing efforts to integrate in-line defect metrology into our process flows
Supporting operations in addressing lot holds across the fleet of Characterization Engineering tool sets
Partner with vendors and equipment engineers to keep tools in good health and ready-to- use state
Supporting statistical process control (SPC), continuous improvement efforts, and the management and dissemination of metrology and defect metrology data