BGA PCB Design Engineer

NVIDIA•Us, CA

13d

About The Position

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. This is our life’s work, to amplify human creativity and intelligence. Make the choice to join us today. What you’ll be doing: Work closely with System Level Architects and product teams to develop high-performance semiconductor BGAs pinouts, optimizing signal integrity and manufacturability. Collaborate with design teams to define product requirements, specifications, and goals. Coordinate with package design teams to optimize interfaces between PCB, package, and silicon. Optimize BGA ballout and layout to achieve superior signal integrity, power integrity, impedance control, and minimal crosstalk. Power delivery and decoupling placement optimization.

Requirements

Bachelor's degree in Electrical Engineering or equivalent experience.
Strong knowledge of signal integrity analysis and PCB layout design principles.
Excellent communication skills and the ability to think around corners to find solutions.
Minimum of 6+ years experience in high-speed design.
Proficiency with Cadence Allegro or comparable PCB design tools.
Breadth and Depth of knowledge in PCB technologies HDI, Blind and buried vias, Backdrill, standard thru hole PCB Material knowledge
Ability to work well in a cross-functional environment on challenging projects.

Nice To Haves

Experience in package design or coordination with package design teams and signal integrity.
Familiarity with industry standards and guidelines for PCB layout design
Track record of working on projects involving high-speed interfaces (e.g., DDR memory, PCI Express, Ethernet).
Understanding of power integrity considerations and multi-gigabit design challenges.

Responsibilities

Work closely with System Level Architects and product teams to develop high-performance semiconductor BGAs pinouts, optimizing signal integrity and manufacturability.
Collaborate with design teams to define product requirements, specifications, and goals.
Coordinate with package design teams to optimize interfaces between PCB, package, and silicon.
Optimize BGA ballout and layout to achieve superior signal integrity, power integrity, impedance control, and minimal crosstalk.
Power delivery and decoupling placement optimization.