BGA Engineer

CSAT Solutions LP•Houston, TX

8h•Onsite

About The Position

CSAT Solutions has always emphasized that outstanding people are the key to our success. We know that outstanding candidates are looking for challenging career opportunities. If you are a highly motivated individual with an entrepreneurial spirit, CSAT Solutions may have a career for you. We invite you to explore the current opportunities available at CSAT Solutions. We are currently seeking qualified candidates to fill the role of a BGA Engineer.

Requirements

Associates degree in Electronics, Computer repair or other technical field preferred
Minimum 3+ years experience in electronics repair, failure analysis, and diagnosis
Strong knowledge of BGA packaging and PCB assembly processes
Experience with SMT, reflow soldering, and stencil design
Hands-on experience with X-ray inspection and failure analysis tools
Familiarity with high-density interconnect (HDI) boards
Proficiency in/through hole soldering, optical inspection, surface mount technology, and cross sectioning of printed circuit boards (PCBs)
Ability to read and interpret schematics/block diagrams with detailed understanding of computer and subassembly functionality
Experienced in Dye and Pry to evaluate integrity of solder joints, real time X-ray of assemblies, and use of thermal chambers for running specialized tests
Ability to use electronic test equipment (oscilloscopes & multi-meters, etc.)
Understanding of IPC standards (IPC-7095, IPC-A-610, IPC-2221)
Proficiency working with computers
Proficient English abilities required
Email and written messaging with intermediate Excel knowledge
Strong communication and cross-functional teamwork skills
Excellent time-management skills
Position is based at CSAT Solutions NW Houston facility.
Requires standing, walking, and working in a production/repair environment for extended periods.
Must be able to lift up to 25 lbs occasionally.
Regular exposure to electronic components, ESD-protected areas, and repair tools.
Standard MondayFriday schedule with occasional overtime as required by business needs.

Responsibilities

Develop and optimize BGA soldering and reflow profiles
Perform DFM/DFA/DFT reviews for BGA components
Analyze and resolve BGA-related failures (open/shorts, head-in-pillow, voiding, warpage)
Support X-ray inspection, AOI, and cross-section analysis
Work with PCB layout teams on pad design, via-in-pad, escape routing
Conduct thermal, mechanical, and reliability testing
Document processes, corrective actions, and engineering reports
Completes component level trouble shooting (capacitor, resistors, etc.)
Tests, troubleshoots and repairs, complex system failures as required
Responsible for meeting ISO 9001 and/or other quality system requirements in their department
Other duties as assigned