TSMC-posted 2 days ago
$37 - $44/Yr
Intern
Hybrid
5,001-10,000 employees

As a Mixed-Signal Design Intern, you will contribute to the design and mixed-signal verification of integrated circuit and systems for power constrained environments and edge applications. You may also work with the team on developing and implementing AI algorithms and possibly co-processors to improve power-performance of such systems. You will report to the section Manager of the mixed signal and digital design division of the Advanced Connectivity Department in Austin, Texas. We are currently operating in a hybrid work schedule with 4 days in office. This Internship Program is open to students currently enrolled in a reputable University that are graduating in 1 year with a MS/PhD degree (2027 graduation). The Summer 2026 internship will begin in May 2026 and continue through August 2026 with the possibility of extending further beyond.

  • Literature review, and contribution to the development and verification of circuits, systems and algorithms to improve energy efficiency of power constrained applications.
  • Work with team members with expertise in device, circuit, and AI system architecture
  • Documentation
  • PhD degree in Electrical/Electronic Engineering OR MS degree in Electrical Engineering
  • Solid background in electronic device fundamentals
  • Solid mixed signal and digital design fundamentals
  • Good understanding of AI algorithms and systems
  • Hands on experience in mixed-signal tape-out in planar or Finfet technologies
  • Basic understanding of SoC integration and physical design
  • Ability to work with Matlab and simulink design environments
  • Ability to work with Python, PyTorch or similar environments
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