Advanced Semiconductor Packaging Engineer

The Aerospace CorporationEl Segundo, CA
4dOnsite

About The Position

The Aerospace Corporation is the trusted partner to the nation’s space programs, solving the hardest problems and providing unmatched technical expertise. As the operator of a federally funded research and development center (FFRDC), we are broadly engaged across all aspects of space— delivering innovative solutions that span satellite, launch, ground, and cyber systems for defense, civil and commercial customers. When you join our team, you’ll be part of a special collection of problem solvers, thought leaders, and innovators. Join us and take your place in space. At the Mission Payloads Division (MPD), we are pioneers in remote sensing systems that guide our country’s space enterprise. Our talented and dynamic people create and flourish in electronics, sensors, radar, artificial intelligence (AI), and advanced data network domains. We boldly advance technology through our research and development and then forward to demonstration and integration . With innovative laboratories and prototyping, MPD delivers groundbreaking results. We guide our Department of Defense, intelligence community, and civil clients to enhance national productivity and security and tackle the most critical missions . Bring your intelligence and creative spirit and join us at MPD! The Parts, Materials & Processes Department (PMPD) includes subject matter experts across a broad range of areas pertaining to electrical, electronic, and electromechanical (EEE) parts procurement, qualification, application, root cause failure analysis, as well as materials and processes. Our expertise combined with a sophisticated in-house electronic component laboratory deliver innovative analysis and PM&P program management capabilities to national space systems and civil customers. PMPD is seeking an Advanced Semiconductor Packaging Engineer (Engineering Specialist - M icroelectronics / Semiconductor Engineering ) with proficiency in packaging, assembly, and testing , related procurement standards, related control boards for program management and adjudication of nonconformities. Work Model : The selected candidate will be required to work full time on-site at our facility at either El Segundo, CA or Chantilly, VA .

Requirements

  • Bachelor’s degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline
  • At least eight years of increasingly responsible and related engineering/scientific experience (time spent obtaining advanced degree counts towards this).
  • Proficiency in industry PMP requirements standards development for advanced semiconductor packaging – including related, component selection , assembly materials, and processes (PMP), and selection of elements
  • Experience supporting parts, materials, and processes (PM&P) program management functions which include -- control boards, design reviews, and manufacturing readiness reviews
  • Excellent record of customer communication and interaction
  • Willingness to travel [domestically/internationally] approx. 25% of time
  • This position requires ability to obtain and maintain a TS/SSBI security clearance, which is issued by the US government.
  • U.S citizenship is to obtain a security clearance.

Nice To Haves

  • Advanced degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline
  • 8+ years of experience in a dvanced semiconductor packaging (time spent obtaining advanced degree counts towards this).
  • Experience leading/managing teams to evaluate, select, and qualify electronic parts, materials, and processes (PMP) for space-related applications while balancing risks
  • Demonstrated ability to assess non-MIL PRF parts and develop appropriate methods for use in space and related high-reliability applications
  • Hold an active TS/SSBI security clearance
  • Proficiency in common root cause analysis tools during problem resolution
  • Experience collaborating with contractors, industry working groups, and/or associations such as NASA Electronics Parts Assurance Group, Defense Logistics Agency, Joint Electron Device Engineering Council, Automotive Electronics Council, during the evaluation, selection , and adaptation of active electronic parts for space-related applications]
  • Possess project management skills in applications such as MS Project, Jira , etc.

Responsibilities

  • Provide ongoing technical consultation and advice to management, internal/external customers, and contractors on the evaluation, selection , and use of a dvanced semiconductor packaging ( e.g., 2.5/3D , system in package, multi-chip module) for space and missile applications
  • May lead cross-organizational teams and organize interfaces within department
  • Collaborate with industry colleagues, and component supplier personnel to create/ maintain guidance and requirements related to selection, screening, qualification, and root cause failure analysis
  • Act as organization’s designated representative at technical meetings, presentation, and workshops
  • Mentor less experienced staff – as – and serve as role model

Benefits

  • Comprehensive health care and wellness plans
  • Paid holidays, sick time, and vacation
  • Standard and alternate work schedules, including telework options
  • 401(k) Plan — Employees receive a total company-paid benefit of 8%, 10%, or 12% of eligible compensation based on years of service and matching contributions; employees are immediately eligible and vested in the plan upon hire
  • Flexible spending accounts
  • Variable pay program for exceptional contributions
  • Relocation assistance
  • Professional growth and development programs to help advance your career
  • Education assistance programs
  • An inclusive work environment built on teamwork, flexibility, and respect
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