Advanced Packaging SI/PI Senior Staff Engineer
About The Position
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs. Many of the new designs require multi-chip and multiple component configurations with high-speed IP requirements. In addition, our team is advancing Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We work with the world's leading manufacturers to solve our client's most challenging designs and integrations with industry-leading packaging techniques. The ideal candidate will have an interest in hardware design and experience working on signal and power integrity verification and design optimization. A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies is required. What You Can Expect Marvell is looking for an individual contributor with demonstrated success in the following areas: Evaluating package or PCB designs for challenging electrical requirements Close interaction with physical designers and IP teams to optimize electrical performance Executing simulation tasks for signal and power integrity sign-off Skills needed to be successful in this role: Understanding of signal integrity and power integrity concepts and fundamentals Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools Working knowledge of circuit extractions and simulation techniques Ability to work with engineers in multiple locations and geographies Strong communication, presentation and documentation skills Familiarity with semiconductor packaging technologies, materials, and substrate or PCB design As a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be responsible for the following: SI/PI analysis of designs and optimization within 2D/2.5D/3D packages Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination. Documenting analysis results and present findings to internal teams. Participating in cross-functional meetings and design reviews. Taking ownership of assigned tasks and following through to completion, adjusting approach as needed to meet goals. What We're Looking For In addition, the candidate will possess a bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3-5 years of experience.
Requirements
- Understanding of signal integrity and power integrity concepts and fundamentals
- Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
- Working knowledge of circuit extractions and simulation techniques
- Ability to work with engineers in multiple locations and geographies
- Strong communication, presentation and documentation skills
- Familiarity with semiconductor packaging technologies, materials, and substrate or PCB design
- bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3-5 years of experience.
Responsibilities
- SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
- Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design
- Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination.
- Documenting analysis results and present findings to internal teams.
- Participating in cross-functional meetings and design reviews.
- Taking ownership of assigned tasks and following through to completion, adjusting approach as needed to meet goals.
Benefits
- employee stock purchase plan with a 2-year look back
- family support programs to help balance work and home life
- robust mental health resources to prioritize emotional well-being
- recognition and service awards to celebrate contributions and milestones
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
