Advanced Packaging Principal Integration Technologist

Merck•Tempe, AZ

18d

About The Position

Work Your Magic with us! Start your next chapter and join EMD Electronics. Ready to explore, break barriers, and discover more? We know you’ve got big plans – so do we! Our colleagues across the globe love innovating with science and technology to enrich people’s lives with our solutions in Healthcare, Life Science, and Electronics. Together, we dream big and are passionate about caring for our rich mix of people, customers, patients, and planet. That's why we are always looking for curious minds that see themselves imagining the unimaginable with us. Everything we do in EMD Electronics is to help us deliver on our purpose of being the company behind the companies, advancing digital living. We are dedicated to being the trusted supplier of high-tech materials, services and specialty chemicals for the electronics, automotive and cosmetics industries. We foster a global collaborative organization made up of individuals who have the passion to win, obsess about the customer, are relentlessly curious and act with urgency. Together, we push the boundaries of science to make more possible for our customers. Your Role: In this role you will be instrumental in developing our High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy and program development. By connecting across key business unit partners and leveraging EMD Electronics core competencies, the candidate will drive business and product development from idea to proof of concept for transfer to high volume manufacturing. The ideal candidate will combine a deep equipment, process and integration knowledge of High Performance Packaging technologies (including Wafer Level Packaging, Hybrid Bonding, Fusion bonding and adjacent technologies) with a vast ecosystem network (both equipment suppliers and IDM/Foundry/Memory customers).

Requirements

MSc or higher (Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields)
8+ Years 300mm Process/ Equipment R&D hands on experience
Advanced Packaging (300mm) Equipment Tool owner
Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development
Experience developing integration and process flows
Experience collaborating with external business developments SOW (Scope of Work)/ POC (Proof of Concept)/DOE’s on equip/material definition

Nice To Haves

5 years’ experience of Advanced Packaging Consortia engagements (IMEC, Fraunhofer, CEA Leti, etc) including engagement model definition/ SOW development/ POC execution.
Demonstrated ability to work in highly ambiguous environments
Demonstrated ability to work across matrixed organizations and deliver results
Demonstrated ability to influence up to garner resources
Entrepreneurial mindset
Ability to condense complicated material down to key actionable items
Ability to enroll resources to deliver success
Demonstrated knowledge of customer/supplier interactions and how best to ‘mine’ the ‘why’s & how’s’ from those conversations
Self-starter, ability to operate with little direction

Responsibilities

Through technical expertise identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps
Transfer knowledge/educate peers (both laterally and up) on High Performance Packaging (Advanced Packaging) roadmaps
Leverage industry knowledge to identify process/equipment/integration challenges
Work across BU’s and CTO office to identify material solutions/developments to solve industry challenges
Leverage industry network and connections to engage the ecosystem on collaborative development opportunities