Advanced Packaging Pathfinding & Development – Thermal Engineer, (Principal / Senior Principal)

Marvell Technology•Austin, TX

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging Pathfinding and Development team is responsible for innovations in advanced packaging to create bleeding edge technologies for product intercepts in 3–5 years. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling, die to die interfaces, and complex power delivery networks that require innovative and custom solutions to meet constantly evolving customer needs for the creation of next generation AI training and inference modules. The team is responsible for driving solutions that are not available off-the-shelf. This includes new design and architectural concepts by partnering with vendors to create industry leading packaging solutions. What You Can Expect We are seeking a Principal or Senior Principal Thermal Engineer to lead thermal pathfinding and development for advanced packaging technologies targeting datacenter applications. The successful candidate will define thermal architectures, influence Marvell and industry roadmaps, and deliver validated solutions spanning silicon package to system and rack level integration.

Requirements

Demonstrated experience in advanced packaging technologies with deep expertise in heat transfer, fluid dynamics, materials science, package assembly and reliability.
Proven experience delivering thermal solutions at both component and system levels.
Experience managing and influencing vendors, substrate manufacturers, OSATs, and foundries.
Bachelor’s degree with 15+ years relevant experience, or Master’s degree with 12+ years relevant experience, or PhD (or post‑doc) with 8+ years relevant experience (Mechanical/Thermal Engineering, Electrical Engineering, Materials Science, or related field)
Thermal Modeling & CAD Tools: Icepak, Flotherm, Celsius; SolidWorks, Creo
Fundamental Expertise: Heat transfer, fluid dynamics, materials science, process
Cooling Technologies: Active and passive cooling solutions
Integration at component, system, and rack levels
System‑Level Thermal Integration: Package ↔ heat sink ↔ board ↔ server chassis ↔ rack
Thermal management for scale‑up and scale‑out architectures
Advanced Packaging Experience: 2.5D / 3D technologies including: CoWoS‑S / R / L; EMIB; CPO; CPC
Thermal Characterization & Validation: Thermal test vehicles (TVs) DAQ systems, calibration curves, LabVIEW Thermocouples, airflow characterization, thermal chambers
Reliability & Failure Analysis: Chip‑package interactions Component‑ and board‑level failure mechanisms
Ability to lead cross‑functional, multi‑site programs across global time zones.
Strong interpersonal skills with a demonstrated ability to influence vendor roadmaps.
Excellent communication, presentation, and technical documentation skills.
Curiosity, adaptability, and willingness to learn emerging technologies.

Nice To Haves

Experience in advanced thermal solutions such as on-package and in-package liquid cooling and immersion cooling is desirable.
Broad understanding of package, interposer, silicon, substrate, and PCB design.
Working knowledge of signal integrity and power integrity.
Prior experience developing packaging solutions for the datacenter market.

Responsibilities

Architect and develop thermal solutions for advanced silicon packages targeting datacenter environments, from concept through validation.
Hands on characterization of thermal test vehicles and cooling solutions.
Define and execute thermal design, materials, and process development at component and system levels.
Partner with external ecosystem stakeholders (vendors, substrate suppliers, OSATs, foundries) to define and align thermal technology roadmaps.
Explore and assess next‑generation cooling technologies beyond current industry offerings; make recommendations and generate protected IP.
Drive technology feasibility studies and deliver proof‑of‑concept demonstrations.
Collaborate cross‑functionally with IP, silicon design, package design, manufacturing, reliability, and test teams.