Advanced Packaging Engineer - SI/PI

Marvell Technology•Austin, TX

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Join Marvell’s central packaging organization responsible for enabling next‑generation connectivity and compute products. You’ll contribute to the design, modeling, and validation of advanced IC packages supporting high‑speed interfaces. Your work in SI/PI will directly influence product performance, reliability, and time‑to‑market. What You Can Expect Collaborate with IC design, physical layout, assembly engineering, and marketing to support package planning and substrate design. Build and correlate SI/PI models for advanced interconnects; perform 2D/3D EM simulations and generate routing, stack‑up, and decoupling guidelines. Analyze power‑distribution networks and high‑speed signal paths from pre‑layout through post‑layout. Perform VNA and TDR characterization of package/PCB structures and compare bench data with simulations. Automate analysis workflows using Python (e.g., simulation sweeps, reporting, rule checks). Document technical results and present recommendations to cross‑functional teams. Contribute to design reviews and support the release of package designs to manufacturing. Use tools such as HFSS, SI‑Wave/Clarity, PowerSI, Spectre/ADS/HSpice, and APD or PADS. What We're Looking For MS or PhD in Electrical/Electronics Engineering, Materials Science, or related fields. Strong fundamentals in electromagnetics, transmission lines, and microwave theory. Experience with 2D/3D EM simulation tools (HFSS, SI‑Wave, Clarity). Familiarity with IC package layout tools such as APD or PADS. Understanding of high‑speed signaling in both frequency and time domain. Exposure to VNA/TDR characterization methods. Working knowledge of circuit‑simulation tools (Spectre, ADS, HSpice). Python scripting experience for SI/PI or packaging automation. Familiarity with packaging technologies, materials, substrate design rules, and assembly processes. Awareness of EMI/EMC debugging and simulation practices. Bonus: Experience with 2.5D/3D package development, MATLAB‑based channel simulations, or basic thermal/mechanical analysis. Strong communication, presentation, and documentation skills. A collaborative team player eager to learn and grow.

Requirements

MS or PhD in Electrical/Electronics Engineering, Materials Science, or related fields.
Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
Experience with 2D/3D EM simulation tools (HFSS, SI‑Wave, Clarity).
Familiarity with IC package layout tools such as APD or PADS.
Understanding of high‑speed signaling in both frequency and time domain.
Exposure to VNA/TDR characterization methods.
Working knowledge of circuit‑simulation tools (Spectre, ADS, HSpice).
Python scripting experience for SI/PI or packaging automation.
Familiarity with packaging technologies, materials, substrate design rules, and assembly processes.
Awareness of EMI/EMC debugging and simulation practices.

Nice To Haves

Experience with 2.5D/3D package development, MATLAB‑based channel simulations, or basic thermal/mechanical analysis.
Strong communication, presentation, and documentation skills.
A collaborative team player eager to learn and grow.

Responsibilities

Collaborate with IC design, physical layout, assembly engineering, and marketing to support package planning and substrate design.
Build and correlate SI/PI models for advanced interconnects; perform 2D/3D EM simulations and generate routing, stack‑up, and decoupling guidelines.
Analyze power‑distribution networks and high‑speed signal paths from pre‑layout through post‑layout.
Perform VNA and TDR characterization of package/PCB structures and compare bench data with simulations.
Automate analysis workflows using Python (e.g., simulation sweeps, reporting, rule checks).
Document technical results and present recommendations to cross‑functional teams.
Contribute to design reviews and support the release of package designs to manufacturing.
Use tools such as HFSS, SI‑Wave/Clarity, PowerSI, Spectre/ADS/HSpice, and APD or PADS.