Advanced Packaging Technologist

Advanced Micro Devices, Inc•Austin, TX

About The Position

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. In this role, you will lead the development of next-generation thermal technologies through rigorous model-based decision making. You will create and apply thermal and multi-physics models to guide architecture definition, design trade-offs, and technology direction across thermal, electro-thermal, and electro-optical domains, with a strong emphasis on package- and PCB-level integration. The ideal candidate is self-motivated, works independently, is highly organized and articulate, and collaborates effectively across cross-functional teams. You are comfortable using models to frame decisions, resolve ambiguity, and drive alignment across diverse engineering disciplines.

Nice To Haves

Direct experience in package- and system-level thermal modeling, coupled with experimental validation and characterization.
Solid foundation in heat transfer, fluid dynamics, and materials science, with the ability to apply first-principles understanding to multi-physics package-and-system-level design trade-offs.
Strong working knowledge of cooling and packaging technologies, including cold plates, vapor chambers, air-cooled heat sinks, thermal interface materials (TIMs), immersion cooling, microfluidics, and electronic packaging architectures.
Experience developing cooling solutions across a range of platforms, including data centers (server- and rack-level cooling), servers (air- and liquid-cooled), mobile systems (laptops and notebooks), and workstations.
Proven relevant industry or research experience in thermal engineering, electronics packaging, or related fields.

Responsibilities

Lead model-based thermal architecture development to support technology pathfinding and product roadmapping.
Partner with package and system architects to deliver thermally optimized end-to-end solutions as part of System-Technology Co-Optimization (STCO).
Collaborate with silicon design teams to enable thermally optimized power and performance while maintaining thermal margins, reliability, and long-term robustness.
Define and execute characterization and validation strategies, partnering with internal and external thermal laboratories to calibrate and correlate models.
Manage consortium and academic research engagements focused on advanced thermal technologies and modeling methodologies.
Participate in technology reviews and evaluations with vendors and external partners.
Define targets and strategic direction for thermal technology development, assess technology readiness, and influence AMD product roadmaps.
Serve as thermal subject-matter expert within advanced packaging and technology integration, ensuring cohesive, end-to-end thermal solutions with a primary focus on data center applications.