ADCE Packaging Design Architect

Intel Corporation • Hillsboro, OR

3d • Hybrid

About The Position

The Advanced Design Customer Enabling (ADCE) group operates within Intel's Assembly Packaging Technology manufacturing organization (APTM). The ADCE Packaging Design Architect works with silicon, package, and board design teams to define and implement strategies that optimize product performance and cost. This involves technical leadership in advanced packaging technologies, such as silicon bridges or interposers.

Requirements

• Strong technical background in design and electrical analysis.
• Solid background in semiconductor fabrication and packaging
• Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
• Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
• Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions.
• Ability to work independently and at various levels of abstraction
• Strong organization, time management, and communication skills, self-motivated.
• Ph.D. or master’s in electrical engineering, chemical engineering, mechanical engineering or material science.
• 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.

Nice To Haves

• Experience and knowledge with assembly process, test and characterization techniques would be an added advantage

Responsibilities

• Drives end-to-end development for substrate design from concept through tapeout and implements physical layout and routing of the package design.
• Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs.
• Works closely with silicon and hardware teams to optimize silicon package board performance and pinout.
• Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design.
• Completes documentation and collateral into the product lifecycle management system of record.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees