2026 Undergrad ASIC Package Engineering Intern/Co-Op

Advanced Micro Devices, Inc.•Austin, TX

59d•Hybrid

About The Position

At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. As an AMD intern or co-op, you'll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You'll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you're an undergrad or a PhD student, your contributions matter-and your experience here will be a launchpad for what comes next. We are seeking highly motivated Package Engineering intern/co-op to join our team. In this role you will be part of AMD's advanced package technology and engineering group within AMD's Adaptive and Embedded Computing Group (AECG).

Requirements

You are currently enrolled in a US based University into a Masters degree program majoring in Materials Science, Mechanical Engineering - or a related field.
Knowledge of material and/or process characterization, specifically in IC packaging.
Skilled in creating package documentation and performing engineering data analysis.
Detailed orientated and multitasking.
Familiarity with FA techniques.
AutoCAD proficiency.
Python programming.
SQL and JMP
Experience with FEA software (such as ANSYS)

Nice To Haves

Thermal simulation tools is a plus

Responsibilities

Working with package & assembly suppliers in both the US & Taiwan for the package assembly & qualification of high reliability flip chip product
Generating or revising key package documentation as required in the package substrate & assembly area.
Helping analyze the assembly yield and quality metrics and assist in setting up key process indicators to ensure high package & assembly quality and reliability.