Intel-posted 9 months ago
$117,140 - $165,370/Yr
Full-time • Mid Level
Chandler, AZ
Computer and Electronic Product Manufacturing

Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundry's Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using some of the world's most advanced manufacturing processes. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy with Foundry Capability, Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond. This exciting transformation at Intel needs talented candidates with Yield Failure Analysis experience in Foundry to service local and global customers. Failure Analysis Engineers in the OTF Yield Department are critical to determining root cause for yield loss and building a strong yield improvement roadmap. OTF Yield is seeking individuals with strong work ethic, diverse background, and broad experience working hands-on with analysis tools to partner with Process and Yield engineers to solve problems.

  • Conduct failure analysis and root cause determination on the latest technologies and products in high-volume manufacturing at Intel.
  • Generate yield improvement outcomes from the results of the analysis in partnership with Yield and Process engineering.
  • Lead and direct the analysis through various modules of the failure analysis lab - from job submission to reporting the final results and executing corrective action.
  • Bachelor's degree in Electrical Engineering, Physics, Materials Science or related STEM field of study with +5 years of related experience.
  • 1+ years of relevant experience in understanding and/or practical experience with semiconductor device physics and contemporary fabrication process technologies.
  • 1+ years of relevant experience in understanding and/or practical experience with materials, surface and device characterization techniques supporting semiconductor science and manufacturing (such as SEM, TEM, EDX, SIMS, XPS, XRD, FTIR or Auger).
  • Willingness to travel for training assignments to one of Intel's manufacturing development sites.
  • US citizenship required.
  • Ability to obtain and maintain a US Government Security Clearance.
  • Master's degree in Electrical Engineering, Physics, Materials Science or related STEM field with +3 years of related experience, or a Ph.D. in the previously mentioned areas.
  • Materials and Sample Preparation methods such as polishing, dimpling, wet/dry etches.
  • SEM, FIB, TEM, LSM (electron, ion, photon beam tools) operation and theory.
  • TEM sample preparation.
  • Fault isolation methods such as: Emission Microscopy (thermal, NIR or optical), TIVA/LIVA/OBIRCH/EBIRCH, LVP, LADA, SMI, lock-in thermography etc.
  • Lab bench or ATE testing capabilities for SoC/CPU.
  • Hands-on experience with electrical device probing and characterization, particularly with atomic force or beam-based methods after some deprocessing/delayering.
  • Experience or background with semiconductor product EDA tools, CAD navigation, testing platforms and test plans.
  • Skills to design and code automation for lab testing/characterization using modern scripting or software development tools - such as Python, Perl/TCL, JSL, R or similar.
  • Exposure to or strong background using statistical analysis tools such as JMP, SAS, Minitab.
  • Familiarity with latest machine learning tools applied to process and device analysis to accelerate root cause determination.
  • Understanding or training in SoC or CPU microarchitecture and testing.
  • Practical or applied lab research is preferred.
  • Prior experience working with US Government contracts including security and sensitive document handling.
  • Active US Government Security Clearance, with a minimum of Secret level.
  • Competitive pay
  • Stock options
  • Bonuses
  • Health benefits
  • Retirement plans
  • Vacation
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