Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and new greenfield site in Ohio. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing at a 2-year cadence going forward. Intel recently created a High-Volume Manufacturing (HVM) Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This job requisition is to seek Yield Analysis engineers for our FSM / HVM Global Yield organization, reporting to the YA team manager. Selected candidates will work with other members in Global Yield org including Process Integration, Device and Defect engineering teams, fab module/yield teams and Technology Development (TD) team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers.