Yield Analysis Systems Engineer

Intel Corporation • Hillsboro, OR

1d • Hybrid

About The Position

ATPM Yield seeks a yield systems engineer to adapt, develop, deploy and sustain yield analysis software solutions in support of our aggressive advanced packaging roadmap. Responsibilities include, but are not limited to: Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, configuration, and analysis enabling. Work closely with partners from automation, metrology, yield/defmet and manufacturing on requirements, enabling, testing and debugging of integrated defect and yield analysis capabilities. Contribute to system integration projects for enhancing advanced packaging capabilities in Klarity / Exensio / custom solutions and integrating Automated Defect Classification. Be creative, customer focused and adaptable to evolving needs as we enable rapid yield learning from technology development to high volume manufacturing. Be able to lead a variety of enabling / debugging projects, role modeling effective problem solving and getting action through influence management. Demonstrate a strong sense of ownership and quality to drive for a mutually effective solution with our partners and customers.

Requirements

• Possess a Bachelor's Degree in Engineering, Computer Science, Data Science, Information Systems, Chemistry, Physics, Materials Science or any other related technical discipline with 3+ years of relevant experience -OR- Master's degree in Engineering, Computer Science, Data Science, Information Systems, Chemistry, Physics, Materials Science or any other related technical discipline with 2+ years of relevant experience, -OR- PhD degree in Engineering, Computer Science, Data Science, Information Systems, Chemistry, Physics, Materials Science or any other related technical discipline with years of 1+ relevant experience
• Experience in python or comparable programming language

Nice To Haves

• Strong problem-solving and teamwork skills
• Experience with Python and SQL
• Experience with Intel's wafer defect metrology and analysis ecosystem
• Previous related work experience in a semiconductor foundry preferred
• Experience with Industry standard Defect and Yield Analysis applications like Klarity or Exensio
• Yield improvement or defect metrology / defect reduction experience
• Experience with ADC (Automated Defect Classification) and Machine Learning / AI.
• Experience with modern distributed version control systems, particularly Git, GitLab, or GitHub

Responsibilities

• Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, configuration, and analysis enabling.
• Work closely with partners from automation, metrology, yield/defmet and manufacturing on requirements, enabling, testing and debugging of integrated defect and yield analysis capabilities.
• Contribute to system integration projects for enhancing advanced packaging capabilities in Klarity / Exensio / custom solutions and integrating Automated Defect Classification.
• Be creative, customer focused and adaptable to evolving needs as we enable rapid yield learning from technology development to high volume manufacturing.
• Be able to lead a variety of enabling / debugging projects, role modeling effective problem solving and getting action through influence management.
• Demonstrate a strong sense of ownership and quality to drive for a mutually effective solution with our partners and customers.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees