The Wireless Module Engineer (WME) is a highly motivated, self-driven technical lead responsible for driving the development of wireless modules from early architecture definition through mass-production ramp. This role requires strong cross-functional collaboration and the ability to deeply engage across a broad spectrum of technical domains including RF design, reliability, manufacturing test, supply chain, and system integration. The WME will initiate and lead early-phase RF architecture and specification discussions between internal engineering teams and Outsourced Semiconductor Assembly & Test (OSAT). They will ensure all OSATs comply with internal specification formats, review procedures, and approval workflows. The WME will drive the formal module design release process, establishing and reviewing checkpoints for schematics, PCB layout, electromagnetic/RF simulation results, design-for-manufacturability (DFM), test data readiness, and OSAT design feedback In addition to communicating risks and priorities, the core responsibility of WME is to manage module integration and ATE test coverage at OSATs. WME will function as a general manager overseeing all aspects of ATE maturity preparation for hardware—such as load boards, daughter cards, sockets, and handlers—and software, firmware, module calibrations, GRR, and CPK/data analysis. This role is expected to drive OSATs, set priorities, and collaborate closely with them to validate and approve the final ATE hardware and software integration, test coverage, and corresponding test limits, ensuring timely delivery of tested modules for product NPI builds. Following the NPI builds, WME will lead the failure analysis process with the OSATs and work with them to implement improvement activities, including enhancing ATE testers, optimizing software/firmware test time, and improving overall yield and retest rates. This role will involve traveling to international OSATs for Module & ATE bring up for 1-2 weeks before the product NPI builds. WME is expected to have a broad spectrum of technical depth to debug additional bring up issues during travel. For e.g. I2C & PCIe interface related issues. This team member will facilitate collaboration with multi-functional groups at Apple and define the test coverage. Typical test coverage includes, but not limited to Open-Short & Continuity test, VCO calibration and test, TX/RX power calibration and test, RF packet test, EVM test, RX sensitivity test. They will collaborate closely with internal reliability engineering teams to translate expected product field-usage profiles into feasible and data-driven reliability test models for modules and components. This role supports multiple product lines within the Hardware Technology organization, ensuring technical excellence, risk visibility, and disciplined execution from early concept through manufacturing ramp.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees