Wafer Process Engineer (IRSP) 2nd Shift

Integra Technologies. • Durham, NC

27d

About The Position

With a 45 year + heritage Micross Components began transforming specialty electronics by creating a global company with the broadest offering of products and services in the industry and quickly became recognized as the leading worldwide single-source supplier of specialty microelectronic components designed and manufactured to the highest quality standards.

Over the years, Micross Components acquired the specialized knowledge of these regional industry leaders to create a single-source solution for integrated circuits of all types and interconnect options.

And today, Micross continues to serve the Aerospace & Defense, Space, Medical, Industrial & Commercial markets with the most comprehensive range of hi-reliability microelectronic components and services available from one source.

Summary:  

The position will primarily focus on learning and supporting wafer processing steps required to further develop and build IR emitter pixels for the IRSP program area.  This includes thin film deposition by PVD, photoreist coats, photoresist develops, dry etches (RIE and ion mill), descums, ultrasonic (US) resist strips, immersion wet etches, microscope inspections, and thin film metrology.  The successful candidate will need to develop an understanding of relevant process integration dependencies (e,g. interaction of patterned resist with etch processes). Understanding the importance of processing results and the need for supporting program schedules is critical.  As time permits, a secondary goal is to become familiar with the process flows required to fabricate advanced interconnects on passive and/or active device wafers (e.g. through-Si Vias (TSV), flip-chip bumps, Cu pillars, redistribution layers, high density microbumps, and Si interposers).  This position will support both externally and internally funded projects.

Requirements

• Due to ITAR regulations, must be US Person
• A.A., B.S., M.S., or PhD in physical science or engineering with wafer processing and cleanroom experience
• Knowledge of wafer processes and basic device processing, with a good background in thin film deposition, dry/wet etch, and photolithography
• Excellent hands-on laboratory skills
• Excellent written and verbal communication skills
• Should be able to collect and analyze data
• Proficient in Microsoft Office
• Be able to generate reports
• Should possess strong analytical skills

Nice To Haves

• Overall experience with metrology measurements, data recording, and data presentation (PowerPoint) is a plus

Responsibilities

• Hands-on engineering resource for fabricating IR emitter pixels on test and device wafers
• Communicating results and concerns in a collaborative, data-driven environment
• Participate and conduct process improvement experiments, as needed; accurately recording and reporting data
• Employ standard troubleshooting protocols
• Comply with all safety policies, practices and procedures
• Comply with all quality and ITAR policies, practices and procedures
• Build meaningful and productive relationships with internal business partners
• Participate in proactive team efforts to achieve departmental and company goals
• Contribute to building a positive team spirit
• Communicate effectively with all levels of employees
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties
• Maintain the highest degree of honesty and integrity at all times
• Perform other duties as assigned

Benefits

• Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: Associate degree