Wafer Fab Process Engineer II

SRI International•Princeton, NJ

4d•$79,533 - $105,381•Onsite

About The Position

A Wafer Fab Process Engineer II is needed by the Microcircuit Emulation Center at SRI International (formerly Sarnoff Corporation) in Princeton, NJ to support the manufacturing of microcircuits (integrated circuits). Through SRI's Generalized Emulation of Microcircuits (GEM) program, the Microcircuit Emulation Center supplies form, fit, function, and interface replacements for obsolete microcircuits. This capability supports production, redesign, and sustainment requirements for the life of a weapon system. SRI’s Microcircuit Emulation Center is a government-supported, U.S.-based Trusted foundry. This position is 100% on site; relocation benefits are not available for this position.

Requirements

BS or BE in chemistry, physics, material science, or an equivalent field.
2-4+ years hands on Wafer Fab processing engineering experience, ideally in the semiconductor industry, in one or more of the following areas: Plasma Etch, Diffusion, Wet Chemistry, Ion Implant, and Chemical Vapor Deposition (CVD).
Due to Government requirements candidates must be a US Citizen or Permanent Resident.
Ability to troubleshoot using analytical methodologies in a collaborative team effort across disciplines.
Must be able to work in a clean room environment for a significant part of the workday and perform flexible shift work when required.
Demonstrated ability to effectively communicate verbally and in writing.
Experience with report writing and preparing Power Point presentations.

Nice To Haves

Process integration knowledge and experience is advantageous.
Computer programming skills, experience creating and editing scripts (MYSQL, JMP, Excel).
Experience working with Lam plasma dry etch systems, RENA wet chemistry benches, Sandvik (MRL) furnaces, Axcelis Purion ion implanters, and AMAT Centura systems.

Responsibilities

Hands-on process engineering to support low-volume, high-product mix microcircuit manufacturing and development.
Process areas of interest include Plasma Etch, Diffusion, Wet Chemistry, Ion Implant, and Chemical Vapor Deposition (CVD).
Capability to support other process areas as required.
Sustaining, improving, and optimizing current processes to support operations.
Working with process engineers to integrate and develop manufacturable processes for existing and future technologies to enable yield improvement, defect reduction, improved reliability, and future technology development.
Working in cross functional teams (Integration, Design, and Layout) to address process issues.
Data collection, correlation, interpretation, and presentation of information to management and co-workers.