Wafer Dicing Technician

Teledyne Technologies Incorporated-posted 3 months ago

$50,500 - $67,300/Yr

Full-time • Entry Level

Camarillo, CA

5,001-10,000 employees

Resume

Match Score

Upload and Match ResumeTrack Jobs with Teal

Join Teledyne Imaging Sensors as a Wafer Dicing Technician! Are you ready to launch your career to the next level? Join our mission-focused team, where we value technical excellence, collaboration, and agility. We’re the world’s leading provider of infrared sensors for space, with customers like NASA, ESA, and the US Department of Defense.

Support daily wafer dicing operation that includes container labels, wafer mounting, saw dicing, demounting, cleaning, measuring and inspection duties.
Work with responsible engineers in dicing operation for quality control, process control and continuous improvements in dicing processes and procedures.
Document and report any nonconformal event and assist root cause analysis.
Work with Manufacturing Execution System (MES) for process execution, data recording and reporting.
Follow all laboratory protocols and safety procedures.

Strong understanding of mechanical drawings on dimensions and tolerances.
Ability to use digital microscope and metrology tools.
Proficiency with Microsoft Word, PowerPoint, and Excel.
Manual dexterity to handle small, precision components.
High School Diploma with 3 years of relevant experience.
U.S. citizenship due to access restrictions.

Competitive Salary & Benefits Package
Health, Dental, Vision, and Life Insurance from Day 1
Paid Vacation, Sick Time, and Holidays
401(k) with Company Match
Employee Stock Purchase Plan
Educational Tuition Reimbursement
Fun Employee Events throughout the year

Track Jobs with Teal

Job Search Resources

•

Resume Builder

•

Resume Examples

•

Cover Letter Examples

Wafer Dicing Technician

Job Search Resources

Tools

Career Hubs

Guides

Company