Wafer Bonding Engineer

Skywater • Kissimmee, FL

3d

About The Position

We are looking for a Bonding Process Development Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve permanent and temporary bonding for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Requirements

• BS Engineering (4 years), MS/PhD preferred (2 years)
• Fab processing tools knowledge/experience and how to support defect feedback to process owners.
• 2-4 years of engineering experience.
• MEMS/CMOS/Packaging bonding knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.
• US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

Nice To Haves

• Project Management skills and/or defined training a plus.

Responsibilities

• Develop and temporary bonding and debonding capabilities for advanced packaging processes using spin-on polymers, laser debond films and tapes.
• Define and maintain automated and manual processes in tape application and temporary bond material deposition.
• Develop and maintain processes in permanent bonding using wafer to wafer techniques such as Hybrid Bonding/DBI.
• Coordinate with appropriate engineering areas to support integration of your processes for bonding and debonding.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts and defects for trends or excursions that can be addressed by integration changes.
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level