Undergrad Thermal Engineering Intern - Oracle Cloud Infrastructure (OCI) - Burlington, MA

Oracle•Burlington, MA

3d•$20 - $38•Onsite

About The Position

The Oracle Hardware Development (OHD) organization in Burlington, MA is looking for a Thermal Mechanical intern to work with our mechanical and thermal design team to support all phases of our development life-cycle, including design, simulation, documentation, and testing/validating prototype thermal designs and measuring airflow in our HW lab. The Company: Oracle is the world's leading provider of business software. With a presence in over 175 countries, we are one of the biggest technology companies on the planet. We're using innovative emerging technologies to tackle real-world problems today. From advancing energy efficiency to reimagining online commerce, the work we do is not only transforming the world of business—it's helping advance governments, power nonprofits, and giving billions of people the tools they need to outpace change. For more information about Oracle (NYSE:ORCL), visit us at oracle.com. Disclaimer: Certain US customer or client-facing roles may be required to comply with applicable requirements, such as immunization and occupational health mandates.

Requirements

Must be enrolled in a Bachelor's Degree program prior to and post internship.
Currently enrolled in a Bachelor's degree in Mechanical Engineering, Thermal Engineering or an equivalent science/engineering field.
Must be returning to the degree program after completion of the internship.
Reside in the United States and/or attend a university in the US.
Able to obtain work authorization in the US in 2026.
Have academic coursework, completed projects, prior internship and/or research experience or equivalent in at least three of the following areas: Mechanical Engineering, Thermodynamics, Fluid Mechanics, Heat Transfer, Materials Science, Control System, Mechanical Design, Systems Engineering
Have proven experience (internships, projects, coursework) working on at least two of the following areas: Industry Standard MCAD tools Digital thermometers Pressure Gauges PCB Design Computational Fluid Dynamics (CFD) Modeling Electronic Packaging

Nice To Haves

Experience with CREO and FlowTherm
Minimum Cumulative GPA of 3.0 or higher

Responsibilities

You will be working on new and challenging thermal and mechanical designs
Handle mechanical and thermal models
Performing thermal and airflow simulations and testing new thermal solutions in our labs

Benefits

Medical, dental, and vision insurance, including expert medical opinion
Short term disability and long term disability
Life insurance and AD&D
Supplemental life insurance (Employee/Spouse/Child)
Health care and dependent care Flexible Spending Accounts
Pre-tax commuter and parking benefits
401(k) Savings and Investment Plan with company match
Paid time off: Flexible Vacation is provided to all eligible employees assigned to a salaried (non-overtime eligible) position. Accrued Vacation is provided to all other employees eligible for vacation benefits. For employees working at least 35 hours per week, the vacation accrual rate is 13 days annually for the first three years of employment and 18 days annually for subsequent years of employment. Vacation accrual is prorated for employees working between 20 and 34 hours per week. Employees working fewer than 20 hours per week are not eligible for vacation.
11 paid holidays
Paid sick leave: 72 hours of paid sick leave upon date of hire. Refreshes each calendar year. Unused balance will carry over each year up to a maximum cap of 112 hours.
Paid parental leave
Adoption assistance
Employee Stock Purchase Plan
Financial planning and group legal
Voluntary benefits including auto, homeowner and pet insurance