Thermal Engineer

Qualcomm-posted 4 months ago
$220,200 - $330,400/Yr
Santa Clara, CA
Computer and Electronic Product Manufacturing
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Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! Our Mission We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.

  • Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals.
  • Support thermal design of packages and systems from concept through detailed design and manufacturing readiness.
  • Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements.
  • Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness.
  • Research thermal management materials and solutions for advanced electronics.
  • Develop and maintain documentation, guidelines, and tools to support design processes and project success.
  • Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.
  • Master's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
  • 5+ years of hands-on experience in thermal modeling within the high-tech industry.
  • Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation.
  • Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak).
  • Understanding of electronics cooling technologies (passive and active).
  • Knowledge of packaging technologies, server design, and thermal management materials.
  • Proven ability to work independently and collaboratively within a cross-functional team environment.
  • Strong technical documentation skills and excellent written and verbal communication.
  • Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
  • 10+ years of hands-on experience in thermal modeling within the high-tech industry.
  • Understanding of OCP product designs and industry best practices.
  • Engineering design and industry experience with high-end servers.
  • Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak).
  • Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware.
  • Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development.
  • Experience with CAD tools (e.g., SolidWorks, Creo).
  • $220,200.00 - $330,400.00 salary range.
  • Competitive annual discretionary bonus program.
  • Opportunity for annual RSU grants.
  • Highly competitive benefits package designed to support success at work, at home, and at play.
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