D-Matrix-posted about 1 month ago
Mid Level
Hybrid • Santa Clara, CA
101-250 employees
Publishing Industries

At d-Matrix, we are focused on unleashing the potential of generative AI to power the transformation of technology. We are at the forefront of software and hardware innovation, pushing the boundaries of what is possible. Our culture is one of respect and collaboration. We value humility and believe in direct communication. Our team is inclusive, and our differing perspectives allow for better solutions. We are seeking individuals passionate about tackling challenges and are driven by execution. Ready to come find your playground? Together, we can help shape the endless possibilities of AI. The position plays a pivotal role in implementing, and supporting advanced liquid-colled / air-cooled AI Inference solutions tailored to meet the needs of enterprise and high-performance computing (HPC) environments. This role will be responsible for the thermal architecture, thermal design, analysis, and validation of thermal technologies within AI Accelerator Card and Server products. This role utilizes and champions a design process based on integration of the thermal solutions with server/rack system for new products and architectures. The ideal candidate will have a strong fundamental background in the implementation of thermal solutions and card, server, chassis / rack design in enterprise electronics.

  • Develop and integrate innovative thermal solutions / applications by collaborating with design, testing, and engineering teams
  • Lead the design, deployment, and delivery of liquid cooled / air-cooled, HPC and AI supercomputing projects, ensuring alignment with performance, quality, and timeline expectations
  • Evaluate the system layout, power consumptions, air flow, acoustics, sensors and related mechanical requirements
  • Perform component, system and rack level thermal and mechanical design for cooling systems
  • Managed data center projects from conception to delivery, ensuring high levels of customer satisfaction
  • Understand system design requirements for High Performance Computing and AI workloads to drive platform configuration guides for x86 and ARM servers
  • Prepare product drawings, BOM, SOP, DFM and system design/test reports
  • Thermal/mechanical debugging, system optimization and documentation
  • Analyze structural and thermal aspects to ensure feasibility and specify thermal interface materials and manufacturing process
  • Provide identification and creation of new techniques to advance thermal/mechanical development and validation
  • Bachelor's degree required, perferrably in Thermal, Mechanical, Electrical Engineering, Computer Science, or related engineering discipline. Master's or PhD is preferred.
  • 8+ years' experience in data center solutions, HPC, AI infrastructire or equivalent is desirable.
  • Experienced thermal engineer with extensive thermal characterization of next generation ASIC products.
  • Develop and validate thermal models for various challenging thermal designs including die, package, system level thermal modeling.
  • Responsibilities include thermal simulations, analysis, and testing to validate thermal solutions to meet the product requirements.
  • Hand-on with experiences working with test equipments such wind tunnels, thermal chamber, heat sinks, cold plates, etc.
  • Collaborate with internal engineers to provide technical guidance to optimize thermal solutions including heat sink and liquid cooling solutions.
  • Work with cross-functional teams including mechanical, electrical, and manufacturing.
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