Thermal Design Lead-Client Platforms

Advanced Micro Devices, Inc•Austin, TX

1d•Hybrid

About The Position

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: Join AMD’s Client Engineering organization to lead thermal strategy and execution across pre- and post-silicon for next‑gen CPUs, GPUs, and mobile systems. You’ll own thermal requirements, modeling, validation, and cross-functional integration—delivering class‑leading products that delight users in performance, acoustics, and comfort. THE PERSON: This person will lead the full lifecycle of thermal engineering for client products, translating silicon and system requirements into effective cooling, power, and performance solutions from pre-silicon design through post-silicon validation. They will collaborate across architecture, platform, and customer teams to model, design, test, and optimize thermal behavior, make data-driven trade-offs, and clearly communicate risks, decisions, and progress to stakeholders up to the executive level.

Requirements

Deep expertise in heat transfer and fluid dynamics, with hands-on system‑level thermal design experience.
Advanced proficiency in CFD for electronics cooling (Icepak and/or Flotherm).
Strong background in thermal validation and debugging of new silicon and system hardware/software issues.
Practical knowledge of thermal components and materials (fans, heatsinks, shields, spreaders, TIMs) and how they impact product performance.
Ability to analyze and message package thermal resistance impacts (e.g., silicon performance, gen‑on‑gen changes) to internal and external audiences.
Proven collaboration across architecture, power/performance, BIOS/firmware, and customer engineering teams.
Executive‑level communication skills—able to distill complex technical topics into clear decisions and updates.
Extensive lab experience including:
Data acquisition and automation
System teardown/rebuild, instrumentation (thermocouples, IR cameras, power/thermal sensors), and test fixture design.
System impedance and fan (P-Q curve) characterization using an airflow bench.
Test planning, execution, and analysis for thermal performance, acoustics, and skin temperature.
BS/MS in Mechanical, Aerospace, Electrical Engineering, or related field.
BS + 8 years or MS + 6 years or PhD + 3 years of relevant experience in thermal design, analysis, and validation of electronic systems

Nice To Haves

Mechanical CAD experience (Creo or SolidWorks).
Experience with Multiphysics modeling and warpage analysis is a bonus.
Experience designing and validating fan control policies/curves for client systems.
Familiarity with PC architecture and hands-on system setup/testing (VRAM, NVMe, VR, memory, charging circuits).
Understanding firmware-managed power/thermal features and controls across APU/CPU, GPU, and combined systems.
Experience influencing IP floorplans and component placement for thermal optimization.

Responsibilities

Lead end-to-end thermal program development for client products (pre-silicon through validation and post-silicon).
Define silicon- and system-level thermal, power, and cooling requirements; author clear customer-facing documentation.
Collaborate with CPU/GPU architecture, performance, BIOS/SMU, packaging, and customer engineering teams to align thermal strategies.
Own thermal design, modeling (CFD), test, and debug for mobile & desktop platforms, drive design decisions and trade-offs.
Develop and validate fan policy/curves; optimize thermal controls for APU/CPU, GPU, and hybrid systems.
Diagnose thermal interactions (power, performance, controls) at silicon, package, and system levels; rapidly drive alternative solutions.
Ensure delivery of best-in‑class designs by influencing IP floorplans, component placement, and system integration for thermals.
Continuously improve processes, methodologies, and automation to accelerate thermal development and validation.
Communicate status, risks, and decisions effectively to executives and cross‑functional stakeholders.