Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Technology and Products Group in Boise, Idaho, has a top-tier TEM lab equipped with the advanced transmission electron microscopes (TEMs) and cutting-edge focused ion beam (FIB) machines. These state-of-the-art instruments are pivotal for imaging and analyzing memory devices, ensuring Micron remains at the forefront of technological innovation! As a DRAM TEM engineer at DTG TEM lab, you will work with Technology Development research groups to develop new processes, new materials and work with Fab engineers to expedite processes for product transfers and improve yield. The successful applicant for this position will be placed at corresponding Engineer level based on previous experience on analytical TEM work, FIB/TEM automation, and education. Responsibilities will include, but are not limited to: Perform daily FIB lamella preparation and TEM analysis, including microstructure and chemical analysis using electron diffraction, EDS and EELS to support the activities in Micron TD and manufacturing Give detailed pass down to the people in next shift to make smooth shift transition Make contributions to optimize the existing lab procedures Work closely with process development teams to solve problems in the new part/module development Develop/adopt advanced FIB/TEM techniques with emphasis on AI/automation related techniques for the utilization in semiconductor process Develop/adopt solutions to enhance the efficiency of data acquisition and data processing in TEM
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Job Type
Full-time
Career Level
Mid Level
Education Level
Ph.D. or professional degree