Technologist, Packaging Engineering

Sandisk•Milpitas, CA

6d•Onsite

About The Position

We are seeking a detail-oriented and analytical Technologist, Packaging Engineering to join our team in Milpitas, United States. In this role, you will drive innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines. You will collaborate with cross-functional teams to design, develop, and optimize packaging systems that meet customer requirements and regulatory standards. The ideal candidate will bring a systematic approach to problem-solving and a commitment to continuous improvement in packaging technology.

Requirements

Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD
Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout
Strong problem-solving skills with demonstrated expertise in experimental design and statistical analysis
Excellent written and verbal communication skills with the ability to collaborate effectively with global cross-functional teams
Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives
Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams.
Familiarity with industry benchmarking trends and packaging technology roadmap development

Nice To Haves

Additional expertise in die attach, wire bonding, wafer thinning, and molding processes is a plus
Experience with machine learning and data analytics utilizing AI technologies
Demonstrated experience mentoring or managing junior engineers is a plus
Continuously track major industry benchmark announcements in packaging and proactively build organizational awareness of competitive and emerging benchmark strategies

Responsibilities

Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
Provide end‑to‑end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross‑functional engineering teams, global factories, and key stakeholders.
Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost‑effective high‑volume introduction of new package designs and advanced assembly processes.
Partner with Packaging R&D organizations worldwide to define, develop, and qualify next‑generation and emerging packaging technologies in alignment with long‑term business strategy and product roadmaps
Drive enterprise‑level assembly yield improvement initiatives and package cost-reduction programs, establishing best practices and measurable performance targets across supported product lines.
Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions.
Lead new products through the transition from low‑volume to high‑volume manufacturing, ensuring yield, quality, and reliability objectives are achieved. Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high‑volume production.
Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level.

Benefits

You will be eligible to participate in Sandisk's Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance.
Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan.
Please note that not all roles are eligible to participate in the LTI program, and not all roles are eligible for equity under the LTI plan.
RSU awards are also available to eligible new hires, subject to Sandisk's Standard Terms and Conditions for Restricted Stock Unit Awards.
We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Sandisk's Savings 401(k) Plan.

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