For more than 40 years, Micross extensive hi-reliability capabilities have served the global Aerospace & Defense, Space, Energy, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. We are seeking a Technical Program Manager with a strong foundation in semiconductor processing, chemical engineering, or materials science, combined with demonstrable experience in program and project management. This individual will oversee and guide the execution of advanced semiconductor packaging and microfabrication processes, including wafer level packaging, traditional IC packaging, e-beam evaporation, chemical etching, plating, and soldering. Serving as the technical lead and program orchestrator, the candidate will provide strategic direction and hands-on support to a skilled engineering and technician team, ensuring deliverables align with project milestones and quality standards. Key responsibilities include managing team operations within cleanroom environments while also assisting in the processing and fabrication within the cleanroom, facilitating weekly customer calls, preparing detailed monthly technical and financial reports, and tracking project budgets and resource allocations. The ideal candidate will possess strong interpersonal and communication skills to serve as a trusted liaison between internal technical teams and external stakeholders. A solid understanding of process development and materials integration is essential, as is the ability to forecast risks, resolve technical challenges, and maintain a dynamic project plan in a fast-paced, innovation-driven setting. A chemistry, material science, or chemical engineering background is a plus, due to many of the key fabrication steps requiring wet processing.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
251-500 employees