Google-posted 7 days ago
Full-time • Manager
Mountain View, CA
5,001-10,000 employees

A problem isn’t truly solved until it’s solved for all. That’s why Googlers build products that help create opportunities for everyone, whether down the street or across the globe. As a Technical Program Manager at Google, you’ll use your technical expertise to lead complex, multi-disciplinary projects from start to finish. You’ll work with stakeholders to plan requirements, identify risks, manage project schedules, and communicate clearly with cross-functional partners across the company. You're equally comfortable explaining your team's analyses and recommendations to executives as you are discussing the technical tradeoffs in product development with engineers. This is a pivotal role dedicated to establishing early-stage silicon operational excellence and manufacturing readiness for the next generation of Consumer System-on-Chip (SoC) products. In this role, you will serve as the central authority tasked with transforming nascent, yet unproven, silicon technologies into components that are highly reliable, readily manufacturable, and cost-optimized for high-volume consumer device integration. This position places a strong emphasis on Technology Readiness Levels and the robust implementation of the global silicon supply chain. Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.

  • Advise cross-functional technical deep dives concerning Power, Performance, and Area (PPA) goals for the integration of complex compute fabrics onto advanced foundry process nodes.
  • Cross-functional development of system on chip (SOC) packaging technology, enabling New Product Introduction (NPI) and Mass Production (MP) operations.
  • Resolve technical and operational challenges related to materials, processes, fixtures, and equipment to enable product delivery and manufacturing process establishment during the concept-to-NPI development phases.
  • Collaborate with the engineering teams to execute structured sourcing evaluations and the selection of foundry and assembly/test suppliers, ensuring all milestones are met until supplier selection is finalized.
  • Bachelor's degree in a technical field, or equivalent practical experience.
  • 8 years of experience as a Semiconductor Process, Yield, or Packaging Engineer.
  • Experience leading cross-functional teams, technical leadership, and executive communication.
  • Ability to travel as required to fulfill job responsibilities.
  • MS or PHD degree in Electrical Engineering, Computer Engineering, or Material Engineering.
  • 20 years of experience in Semiconductor Manufacturing (including wafer processing or packaging processing) and testing.
  • Experience with SoC and Power Management Integrated Circuit (PMIC) productization.
  • Ability to grow in a dynamic, rapidly evolving professional environment.
  • Excellent people management, written and verbal communication skills.
  • bonus
  • equity
  • benefits
© 2024 Teal Labs, Inc
Privacy PolicyTerms of Service