About The Position

Are you a bright Master's or PhD student passionate about thermal management and eager to make a real impact on semiconductor technology? Join TSMC for a transformative Summer 2026 internship in our Corporate Research team. This unique opportunity allows you to conduct cutting-edge research in thermal materials, advanced measurements, and innovative cooling solutions, directly helping to build the future of computing by making powerful chips more efficient. You'll gain valuable hands-on experience, collaborate with industry experts, and develop critical skills, all while contributing to world-changing advancements. We're looking for self-motivated individuals with hands-on experience in material processing, characterization, or simulation, and a strong drive to innovate in areas like novel thermal materials or liquid cooling technology. As a trusted technology and capacity provider, TSMC is driven by the desire to be: The world’s leading dedicated semiconductor foundry The technology leader with a strong reputation for manufacturing excellence Advancing semiconductor manufacturing innovations to enable the future of technology TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world. In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company has continued to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

Requirements

  • Currently pursuing a Master's or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
  • Demonstrated hands-on expertise in one or more of the following: advanced material processing, sophisticated characterization techniques, innovative device fabrication, precision electrical and thermal measurements, or high-fidelity simulation and modeling.
  • Exceptional technical problem-solving acumen, coupled with superior analytical capabilities and outstanding written and verbal communication skills.
  • A self-driven, proactive mindset with an insatiable curiosity for exploring nascent technologies and a proven ability to thrive within a collaborative, high-performance team environment.

Nice To Haves

  • Proven experience in novel material development, advanced integration processes, and rigorous testing methodologies.
  • Deep familiarity with cutting-edge thermal materials and advanced thermal management concepts.
  • Specific experience with Liquid Cooling Technology (e.g., single-phase, two-phase, microfluidics) or other advanced cooling paradigms.
  • A strong publication record or significant project experience demonstrating your research capabilities in relevant areas.

Responsibilities

  • Lead cutting-edge research and engineering development in advanced thermal materials, characterization techniques, and integrated thermal management solutions for next-generation semiconductor devices.
  • Design, execute, and meticulously analyze complex experiments, leveraging state-of-the-art testing and simulation platforms. Compile comprehensive, insightful reports that drive strategic decisions.
  • Actively engage in high-level research group discussions, presenting your groundbreaking findings and collaborating with our world-class R&D professionals.

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What This Job Offers

Career Level

Intern

Education Level

Ph.D. or professional degree

Number of Employees

5,001-10,000 employees

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